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Texas Instruments |
Part No. |
REF6145IDGKR
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Description |
8ppm/C High-Precision Voltage Reference with Integrated High-Bandwidth Buffer 8-VSSOP -40 to 125
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Tech specs |
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Get Free Sample |
Official Product Page
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Texas Instruments |
Part No. |
ADS6145IRHBT
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Description |
14-Bit, 125-MSPS Analog-to-Digital Converter (ADC) 32-VQFN -40 to 85
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Tech specs |
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Official Product Page
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Vishay Beyschlag
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Part No. |
BYM11-50 BYM11-800 BYM11-600 BYM11-400 BYM11-100 BYM11-200 BYM11-1000 BYM11-600/76 BYM11-600/46 BYM11-1000/26 BYM11-100/26 BYM11-600/26
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Description |
1 A, 100 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 1 A, 1000 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 1 A, 600 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 Surface Mount Glass Passivated Junction Fast Switching Rectifier, Forward Current 1.0 A
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File Size |
32.47K /
2 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
Part No. |
REF6145IDGKT
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Description |
8ppm/C High-Precision Voltage Reference with Integrated High-Bandwidth Buffer 8-VSSOP -40 to 125
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Tech specs |
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Official Product Page
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L-com, Inc.
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Part No. |
PUMA68S4000/I-45 PUMA68S4000/M-45 PUMA68S4000/AI-35 PUMA68S4000/AM-35 PUMA68S4000/AM-45 PUMA68S4000-45 PUMA68S4000/I-35
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Description |
24MHZ, TQFP, IND TEMP, GREEN(MCU 5X) 33MHZ, PLCC, COM TEMP(MCU 5X) 8051 32K FLASH 4 TO 5.5V,PDIP,GREEN(MCU 5X) 24MHZ, PDIP, IND TEMP(MCU 5X) x32 SRAM Module 20MHZ, TSSOP, IND TEMP, 2.4-5.5V(MCU 5X) 24MHZ, TQFP, COM TEMP(MCU 5X) X32号的SRAM模块
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File Size |
132.55K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
54242-808161450LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
59132-T40-16-145LF
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Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions, 2.00mm (0.079in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-409061450LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 6 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-406061450LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-109261450LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-107261450LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-108061450LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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