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INTERSIL[Intersil Corporation]
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Part No. |
ACTS573MS 5962F9672501VXC 5962F9672501VRC FN4092 ACTS573D ACTS573HMSR ACTS573K
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110m x 110m
Metallization Mask Layout
ACTS573MS
(20) VCC
(19) Q0
(18) Q1
(1) OE
(3) D1
(2) D0
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Description |
Dual J-K Negative-Edge-Triggered Flip-Flop With Clear And Preset 16-PDIP 0 to 70 Radiation Hardened Octal Three-State Transparent Latch From old datasheet system
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File Size |
44.37K /
3 Page |
View
it Online |
Download Datasheet
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Intersil
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Part No. |
HI-5701_883 FN3378
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OCR Text |
...SIVATION: Type: SiO2 Thickness: 8ka 1kA DIE ATTACH: Material: Gold Silicon Eutectic Alloy Temperature: Ceramic DIP - 460oC (Max) WORST CASE CURRENT DENSITY: 3.05 x 104 A/cm2
Metallization Mask Layout
HI-5701/883
OVF
VSS
D5
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Description |
6-Bit, 30 MSPS Flash A/D Converter From old datasheet system
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File Size |
64.92K /
8 Page |
View
it Online |
Download Datasheet
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Price and Availability
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