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1078068 APTD321 3CX1500 45000 29LV400 CXP82300 R136F MAX1645
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    IRL3103L IRL3103S IRL3103STRR IRL3103STRL

IRF[International Rectifier]
Part No. IRL3103L IRL3103S IRL3103STRR IRL3103STRL
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description 30V Single N-Channel HEXFET Power MOSFET in a TO-262 package
30V Single N-Channel HEXFET Power MOSFET in a D2-Pak package
Power MOSFET(Vdss=30V, Rds(on)=12mohm, Id=64A)

File Size 123.16K  /  10 Page

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    IRL530NL IRL530NS

International Rectifier
Part No. IRL530NL IRL530NS
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description HEXFET? Power MOSFET

File Size 174.32K  /  10 Page

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    IRLZ44NL IRLZ44NS

IRF[International Rectifier]
Part No. IRLZ44NL IRLZ44NS
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description Power MOSFET(Vdss=55V, Rds(on)=0.022ohm, Id=47A)
HEXFET? Power MOSFET

File Size 174.53K  /  10 Page

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    RF2514

RFMD[RF Micro Devices]
Part No. RF2514
OCR Text ...tage ranging from 2.2V to 3.6V, accommodating designs using three NiCd battery cells, two AAA flashRev A2 010215 RF2514 light cells, or a lithium button battery. The device is capable of providing up to +5dBm output power into a 50 lo...
Description From old datasheet system
VHF/UHF TRANSMITTER
Communication Miscellaneous - Datasheet Reference

File Size 266.72K  /  14 Page

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    pmc
Part No. 2000326
OCR Text .../SDH payloads to system timing, accommodating plesiochronous timing offsets between the line and system timing references, through pointer processing. * The entire SONET/SDH transport and path overheads are extracted to and inserted from de...
Description From old datasheet system

File Size 104.04K  /  2 Page

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    IRL3303L IRL3303S IRL3103L

IRF[International Rectifier]
Part No. IRL3303L IRL3303S IRL3103L
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2 Pak is suitable for high current applications b...
Description HEXFET? Power MOSFET
HEXFET Power MOSFET

File Size 154.16K  /  10 Page

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    DSK9K1208U0A K9K1208U0A-YCB0 K9K1208U0A-YIB0 DS_K9K1208U0A K9K1208U0A K9K1208U0C

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. DSK9K1208U0A K9K1208U0A-YCB0 K9K1208U0A-YIB0 DS_K9K1208U0A K9K1208U0A K9K1208U0C
OCR Text ...connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 16 cells that are serially connected to form a NAND structure. Each ...
Description 64M x 8 Bit / 32M x 16 Bit NAND Flash Memory
TV 16C 16#16 SKT RECP 6400 × 8位NAND闪存
64M x 8 Bit NAND Flash Memory Data Sheet

File Size 356.63K  /  27 Page

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    IRLZ34S IRLZ34L

IRF[International Rectifier]
Part No. IRLZ34S IRLZ34L
OCR Text ... mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications be...
Description HEXFET Power MOSFET
HEXFET? Power MOSFET

File Size 353.16K  /  10 Page

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