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Amphenol Communications Solutions |
Part No. |
L717HDC62PC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDCH62PC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 4-40 Rear Insert, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L717HDCG62PC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Vishay Beyschlag VISHAY SEMICONDUCTORS
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Part No. |
BYM10-1000/26 BYM10-600/46 BYM10-100/26 GL41T-HE3
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Description |
1 A, 1000 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 1 A, 600 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 1 A, 100 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2 1 A, 1300 V, SILICON, SIGNAL DIODE, DO-213AB
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File Size |
327.20K /
4 Page |
View
it Online |
Download Datasheet
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Price and Availability
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