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  glass-field Datasheet PDF File

For glass-field Found Datasheets File :: 1989    Search Time::1.891ms    
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    BUK78150-55

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. BUK78150-55
OCR Text ...ting for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). January 1998 7 Rev 1.000 Philips Semiconductors Product specification TrenchMOSTM transistor Standard level FET MECHANICAL DATA Dimensio...
Description CAP,2.2uF,50VDC,10-% Tol,10 % Tol
TrenchMOS transistor Standard level FET

File Size 49.86K  /  9 Page

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    HFBR-5001 HFBR-5111 HFBR-5112 HFBR-5113 HFBR-5198 HFBR-5113FDB HFBR-5113FDM HFBR-5113FDS HFBR-5113FDN

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HFBR-5001 HFBR-5111 HFBR-5112 HFBR-5113 HFBR-5198 HFBR-5113FDB HFBR-5113FDM HFBR-5113FDS HFBR-5113FDN
OCR Text ...PLATED BRASS. 5. THE HOUSING IS GLASS FIBER FILLED BLACK POLYETHERIMIDE. 6. THE MODULE IS SHOWN WITHOUT THE FIELD KEY INSTALLED. Figure 2(a). HFBR-5111 Outline Drawing. 34.46 (1.357) 30.48 (1.200) 29.00 (1.142) 2.54 TYP. (0.100) 24.86...
Description Low Cost, Industry Standard FDDI MIC Transceivers
Low cost, industry standart FDDI MIC transceiver

File Size 271.14K  /  15 Page

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    MRF19030 MRF19030R3 MRF19030SR3

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MRF19030 MRF19030R3 MRF19030SR3
OCR Text ... Microstrip 0.030 x 3.00 x 5.00 Glass Teflon, Arlon Figure 1. MRF19030 Test Circuit Schematic C2 C3 R1 B1 B2 R2 R3 R4 L2 C1 C4 B3 R5 C9 L3 C6 C7 L4 C5 C8 R6 B4 R7 B5 L1 C10 MRF19030 Rev. 0 Figure 2. MRF19030 Test Ci...
Description RF POWER FIELD EFFECT TRANSISTORS L BAND, Si, N-CHANNEL, RF POWER, MOSFET

File Size 386.08K  /  8 Page

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    MRF19060 MRF19060R3 MRF19060SR3

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
Part No. MRF19060 MRF19060R3 MRF19060SR3
OCR Text ... 0.420 x 0.080 Microstrip 0.030 Glass Teflon Arlon GX-0300-55-22, 2 oz Cu Figure 1. MRF19060 Test Circuit Schematic MOTOROLA RF DEVICE DATA MRF19060 MRF19060R3 MRF19060SR3 3 TO GATE BIAS FEEDTHRU C2 C1 R2 R1 R3 C3 C4 C5...
Description RF POWER FIELD EFFECT TRANSISTORS L BAND, Si, N-CHANNEL, RF POWER, MOSFET

File Size 382.95K  /  8 Page

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    MRF9060 MRF9060R1 MRF9060S MRF9060SR1

飞思卡尔半导体(中国)有限公司
Motorola, Inc.
Advanced Semiconductor
MOTOROLA[Motorola, Inc]
Part No. MRF9060 MRF9060R1 MRF9060S MRF9060SR1
OCR Text ...10 mil Brass Wear Blocks 30 mil Glass Teflon, r = 3.55 Copper Clad, 1 oz Cu Etched Circuit Board RF-35-0300 MRF9060 900 MHz, Rev. 2 Taconic Description Value, P/N or DWG 95F786 95F787 100B470JP 500X 44F3360 100B100JP 500X 93F2975 100B3R0JP ...
Description 4 MEGABIT 3.3 VOLT SERIAL CONFIGURATION UHF BAND, Si, N-CHANNEL, RF POWER, MOSFET
20 characters x 4 Lines, 5x7 Dot Matric Character and Cursor
945 MHz, 60 W, 26 V LATERAL N-CHANNEL BROADBAND RF POWER MOSFETs

File Size 388.20K  /  12 Page

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    SLD131UL

SONY[Sony Corporation]
Part No. SLD131UL
OCR Text ...0.5 3 90 2 1 Window Glass 0.8 0 5.6 - 0.05 4.4 MAX 3.8 MAX 0.6 0.5 MIN 0.4 0.2 5 30 1.26 2 3 1 3 - 0.45 PCD 2.0 Reference Plane LD Chip & Photo Diode Optical Distance = 1.35 0.15 SONY CODE EIAJ CODE JE...
Description GaAlAs Laser Diode

File Size 126.54K  /  7 Page

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    BUK582-100A

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BUK582-100A
OCR Text ...ting for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). January 1998 6 Rev 1.100 Philips Semiconductors Product Specification PowerMOS transistor Logic level FET MECHANICAL DATA Dimensions in ...
Description PowerMOS transistor Logic level FET

File Size 50.45K  /  8 Page

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    BUK582-60A

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. BUK582-60A
OCR Text ...ting for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick). April 1993 7 Rev 1.000 Philips Semiconductors Product Specification PowerMOS transistor Logic level FET MECHANICAL DATA Dimensions in mm...
Description PowerMOS transistor Logic level FET 2.5 A, 60 V, 0.15 ohm, N-CHANNEL, Si, POWER, MOSFET

File Size 56.21K  /  9 Page

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    LZ24BP

Sharp Corporation
SHARP[Sharp Electrionic Components]
Part No. LZ24BP
OCR Text ...00.10 () (Unit : mm) 0.03 Glass Lid 10.000.10 CCD Package 1.390.05 0.03 Cross section A-A' 5.000.075 0.500.50 CCD 1 0.500.50 5.000.075 7 Rotation error of die : = 1.0 MAX. 3.500.30 3.350.10 2.550.10 A 5.02MAX...
Description 1/4-type Progressive-scan Color CCD Area Sensor with 350 k Pixels

File Size 82.77K  /  10 Page

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    MGSF1N02ELT1 MGSF1N02ELT3 ON1887 MGSF1N02EL

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. MGSF1N02ELT1 MGSF1N02ELT3 ON1887 MGSF1N02EL
OCR Text ... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 416 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to ...
Description N-CHANNEL LOGIC LEVEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 114.32K  /  5 Page

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For glass-field Found Datasheets File :: 1989    Search Time::1.891ms    
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