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GP1A16R 10A12 P973T T3524 QS53806 62004 000WD 09S1MNZ
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For paste Found Datasheets File :: 3738    Search Time::1.75ms    
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    TE Connectivity, Ltd.
Part No. NT11S-SF121201431 NT20S-S121-EV3 NT20S-S121-EV3201443 NT11S-ZA3AT-EV1
OCR Text ...software features: ? cut, copy, paste, group, ungroup ? batch change of allocated bits and words ? import bitmaps ? 10 levels of undo/redo ? nt series support tool can be used with the following omron touchscreen models: nt11s-sf121(b) nt20...
Description TOUCH SCREEN HMI
OPERATOR INTERFACE 4 LINE
SOFTWARE NT11S
4 LINE HMI 4线人机界

File Size 710.93K  /  37 Page

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    Allegro MicroSystems, Inc.
Part No. CM1440-06CP CM1440-06CS
OCR Text ...ux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum sol...
Description 6 Channel EMI Filter Array with ESD Protection

File Size 793.87K  /  9 Page

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    Infineon Technologies A...
Part No. F3L300R12ME4-B22
OCR Text ...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,03 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c j 3 technischeinformation/technicalinformatio...
Description EconoDUAL3 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled HE Diode und NTC

File Size 664.53K  /  11 Page

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    TDA8011 TDA8011T

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA8011 TDA8011T
OCR Text ...in most applications. BY SOLDER paste REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be DEFINITIONS Data sheet status Objective specification Preliminary specification Pr...
Description IF amplifier for satellite TV receivers

File Size 74.46K  /  12 Page

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    Infineon Technologies A...
Part No. F3L300R07PE4 F3L300R07PE4-13
OCR Text ...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,063 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c j 3 technischeinformation/technicalinformati...
Description EconoPACK4 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und NTC

File Size 799.18K  /  11 Page

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    SD-44828-001 448281162 UCP2008-0962

Molex Electronics Ltd.
Part No. SD-44828-001 448281162 UCP2008-0962
OCR Text ....1 pcb layout 5.1.2 solder paste stencil layout 5.1.3 reflow profile 5.1.4 inspection 5.2 45560 smt cradle connector 6 5.2.1 pcb layout 5.2.2 solder paste stencil layout 5.2.3 reflow profile 5.2.4 inspection 5.3...
Description 0.8MM HANDYLINK SMT RECEPTACLE 16 CIRCUIT

File Size 1,220.55K  /  27 Page

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    Infineon Technologies A...
Part No. F3L200R07PE4 F3L200R07PE4-13
OCR Text ...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,063 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c j 3 technischeinformation/technicalinformati...
Description EconoPACK4 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und NTC

File Size 816.29K  /  11 Page

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    GP2W1001YP0F

Sharp Electrionic Components
Part No. GP2W1001YP0F
OCR Text ...2.375 3.325 0.65 4.275 : solder paste area dimensions are shown for reference. please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern...
Description IrDA Compliant Transceiver Module 9.6 kb/s to 4 Mb/s (FIR) Low Profile Low Consumption Current

File Size 308.90K  /  14 Page

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    CL-L103-C3N-C

CITIZEN ELECTRONICS CO., LTD.
Part No. CL-L103-C3N-C
OCR Text ... however, the use of insulating paste is strongly recommended in order to avoid short circuit. this product could be bent during the clamping operation if heat grease in sheet form is used. for this reason, it is recommended that g...
Description LED lamp

File Size 212.90K  /  9 Page

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