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  thickness.0027 Datasheet PDF File

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    26-61-2100 41771-0027

Molex Electronics Ltd.
Part No. 26-61-2100 41771-0027
OCR Text ...) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch...0027 Reference - Drawing Numbers Product Specification Sales Drawing PS-08-50, PS-40-02 SD-41771...
Description 3.96mm (.156) Pitch KK? Solid Header, Vertical, without Peg, 10 Circuits, Gold (Au) Plating

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    PTFA142401EL PTFA142401FL

Infineon Technologies AG
Part No. PTFA142401EL PTFA142401FL
OCR Text ..., s = source, g = gate. 5. lead thickness: 0.102 +0.051/?0.025 [.004 +.002/?.001]. 6. gold plating less than 0.25 micron [10 microinch]. fin...0027 h-34288-2.dwg package outline specifications (cont.) package h-34288-2 d iagram notes?unless...
Description Thermally-Enhanced High Power RF LDMOS FET 240 W, 1450 ?1500 MHz

File Size 439.80K  /  10 Page

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    CEP12D38NP-0R6MC-H CEP12D38NP-1R8MC CEP12D38NP-4R0MC CEP12D38 CEP12D38NP-0R6MB-H CEP12D38NP-1R0MB CEP12D38NP-1R0MC CEP12

SUMIDA[Sumida Corporation]
Part No. CEP12D38NP-0R6MC-H CEP12D38NP-1R8MC CEP12D38NP-4R0MC CEP12D38 CEP12D38NP-0R6MB-H CEP12D38NP-1R0MB CEP12D38NP-1R0MC CEP12D38NP-1R1MB-H CEP12D38NP-1R1MC-H CEP12D38NP-1R8MB CEP12D38NP-1R8MB-H CEP12D38NP-1R8MC-H CEP12D38NP-2R6MB-H CEP12D38NP-2R6MC-H CEP12D38NP-2R8MB CEP12D38NP-2R8MC CEP12D38NP-4R0MB
OCR Text ...2 RECOMMENDED METAL MASK THICKNESS IS 0.2mm. SO LD ER R ES IS T L AN D 11.4 7.1 2-2.ELECTRICAL CHARACTERISTICS ...0027 2-3.ELECTRICAL CHARACTERISTICS (IN THE CASE OF REEL) INDUCTANCE [WITHIN] ... () [MAX.] (at...
Description CEP12D38

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    MKTD04

Sharma Electro Components,Inc
Part No. MKTD04
OCR Text ...ape Sprocket hole diameter Tape thickness Symbol d P P0 P P2 F h H1 H L W W0 W1 W2 D0 T Dimensions (mm) Lead Spacing 7.5mm 0.6 12.7 12.7 3.75 0 7.5 0 20.0 16.0 11.0 18.0 13.0 9.0 3max 4.0 0.7 Toll 0.05 0.1 0.2 0.5 0.8 2.0 0.5 0.5 0...
Description Film Capacitors

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    XP1018-BD-EV1 XP1018-BD-000X XP1018-BD

Mimix Broadband
Part No. XP1018-BD-EV1 XP1018-BD-000X XP1018-BD
OCR Text ...re shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)...
Description 37.0-42.0 GHz GaAs MMIC Power Amplifier

File Size 354.96K  /  8 Page

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    Infineon Technologies
Part No. PTFA142401EL
OCR Text ..., s = source, g = gate. 5. lead thickness: 0.102 +0.051/?0.025 [.004 +.002/?.001]. 6. gold plating less than 0.25 micron [10 microinch]. fin...0027 h-34288-2.dwg package outline specifications (cont.) package h-34288-2 d iagram notes?unless...
Description Thermally-Enhanced High Power RF LDMOS FET

File Size 456.56K  /  10 Page

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    ABRACON CORP
Part No. AIMC-0603-R0018S AIMC-0603-R0047S
OCR Text ... width 3 thickness 3 termination 3 (l) (w) (t) (bw) aimc-0402 aimc-0603 0....0027 8 100 7000 0.20 500 aimc-0603-r0033s 0.0033 8 100 6200 0.20 500 aimc-...
Description 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 146.60K  /  1 Page

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    MKTD05

SHARMA[Sharma Electro Components,Inc]
Part No. MKTD05
OCR Text ...ape Sprocket hole diameter Tape thickness Symbol d P P0 P1 P2 F h H1 H0 L W W0 W1 W2 D0 T Dimensions (mm) Lead Spacing 5mm 0.3 12.7 12.7 3.85 6.35 5.0 0 20.0 16.0 11.0 18.0 13.0 9.0 3max 4.0 0.7 Toll 0.05 0.1 0.2 0.5 1.3 0.8 2.0 0....
Description Sharma Film Capacitors

File Size 305.99K  /  4 Page

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    Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
Part No. ISL9N302AS3ST N302AS ISL9N302AS3 ISL9N302AS3S ISL9N302AS3STNL
OCR Text ...number of copper layers and the thickness of the board. 3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transien...
Description N-Channel Logic Level PWM Optimized UltraFET Trench Power MOSFETs
Product information
N-Channel Logic Level PWM Optimized UltraFETTrench Power MOSFETs

File Size 197.19K  /  11 Page

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    NTR2101P NTR2101PT1

ON Semiconductor
Part No. NTR2101P NTR2101PT1
OCR Text ...imension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318 ? 01 thru ? 07 and ? 09 obsolete, new standard 318 ? 08. mm inches scale 10:1 0.8 0.031...
Description Small Signal MOSFET 8.0V, 3.7A, Single P Channel, SOT23(8.0V, 3.7A双功率MOSFET) 小信号MOSFET 8.0V.7A,单P通道,SOT23封装8.0V.7A双功率MOSFET的)
Small Signal MOSFET -8 V, -3.7 A, Single P-Channel, SOT-23; Package: SOT-23 (TO-236) 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000 3700 mA, 8 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB

File Size 135.63K  /  5 Page

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