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				Molex Electronics Ltd.
Part No.	26-61-2100 41771-0027
OCR Text	...) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch...0027 Reference - Drawing Numbers Product Specification Sales Drawing PS-08-50, PS-40-02 SD-41771...
Description	3.96mm (.156) Pitch KK? Solid Header, Vertical, without Peg, 10 Circuits, Gold (Au) Plating
File Size	237.23K / 8 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	PTFA142401EL PTFA142401FL
OCR Text	..., s = source, g = gate. 5. lead thickness: 0.102 +0.051/?0.025 [.004 +.002/?.001]. 6. gold plating less than 0.25 micron [10 microinch]. fin...0027 h-34288-2.dwg package outline specifications (cont.) package h-34288-2 d iagram notes?unless...
Description	Thermally-Enhanced High Power RF LDMOS FET 240 W, 1450 ?1500 MHz
File Size	439.80K / 10 Page	View it Online	Download Datasheet

				SUMIDA[Sumida Corporation]
Part No.	CEP12D38NP-0R6MC-H CEP12D38NP-1R8MC CEP12D38NP-4R0MC CEP12D38 CEP12D38NP-0R6MB-H CEP12D38NP-1R0MB CEP12D38NP-1R0MC CEP12D38NP-1R1MB-H CEP12D38NP-1R1MC-H CEP12D38NP-1R8MB CEP12D38NP-1R8MB-H CEP12D38NP-1R8MC-H CEP12D38NP-2R6MB-H CEP12D38NP-2R6MC-H CEP12D38NP-2R8MB CEP12D38NP-2R8MC CEP12D38NP-4R0MB
OCR Text	...2 RECOMMENDED METAL MASK THICKNESS IS 0.2mm. SO LD ER R ES IS T L AN D 11.4 7.1 2-2.ELECTRICAL CHARACTERISTICS ...0027 2-3.ELECTRICAL CHARACTERISTICS (IN THE CASE OF REEL) INDUCTANCE [WITHIN] ... () [MAX.] (at...
Description	CEP12D38
File Size	279.81K / 6 Page	View it Online	Download Datasheet

				Sharma Electro Components,Inc
Part No.	MKTD04
OCR Text	...ape Sprocket hole diameter Tape thickness Symbol d P P0 P P2 F h H1 H L W W0 W1 W2 D0 T Dimensions (mm) Lead Spacing 7.5mm 0.6 12.7 12.7 3.75 0 7.5 0 20.0 16.0 11.0 18.0 13.0 9.0 3max 4.0 0.7 Toll 0.05 0.1 0.2 0.5 0.8 2.0 0.5 0.5 0...
Description	Film Capacitors
File Size	484.48K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1018-BD-EV1 XP1018-BD-000X XP1018-BD
OCR Text	...re shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)...
Description	37.0-42.0 GHz GaAs MMIC Power Amplifier
File Size	354.96K / 8 Page	View it Online	Download Datasheet

				Infineon Technologies
Part No.	PTFA142401EL
OCR Text	..., s = source, g = gate. 5. lead thickness: 0.102 +0.051/?0.025 [.004 +.002/?.001]. 6. gold plating less than 0.25 micron [10 microinch]. fin...0027 h-34288-2.dwg package outline specifications (cont.) package h-34288-2 d iagram notes?unless...
Description	Thermally-Enhanced High Power RF LDMOS FET
File Size	456.56K / 10 Page	View it Online	Download Datasheet

				ABRACON CORP
Part No.	AIMC-0603-R0018S AIMC-0603-R0047S
OCR Text	... width 3 thickness 3 termination 3 (l) (w) (t) (bw) aimc-0402 aimc-0603 0....0027 8 100 7000 0.20 500 aimc-0603-r0033s 0.0033 8 100 6200 0.20 500 aimc-...
Description	1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size	146.60K / 1 Page	View it Online	Download Datasheet

				SHARMA[Sharma Electro Components,Inc]
Part No.	MKTD05
OCR Text	...ape Sprocket hole diameter Tape thickness Symbol d P P0 P1 P2 F h H1 H0 L W W0 W1 W2 D0 T Dimensions (mm) Lead Spacing 5mm 0.3 12.7 12.7 3.85 6.35 5.0 0 20.0 16.0 11.0 18.0 13.0 9.0 3max 4.0 0.7 Toll 0.05 0.1 0.2 0.5 1.3 0.8 2.0 0....
Description	Sharma Film Capacitors
File Size	305.99K / 4 Page	View it Online	Download Datasheet

				Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
Part No.	ISL9N302AS3ST N302AS ISL9N302AS3 ISL9N302AS3S ISL9N302AS3STNL
OCR Text	...number of copper layers and the thickness of the board. 3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transien...
Description	N-Channel Logic Level PWM Optimized UltraFET Trench Power MOSFETs Product information N-Channel Logic Level PWM Optimized UltraFETTrench Power MOSFETs
File Size	197.19K / 11 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	NTR2101P NTR2101PT1
OCR Text	...imension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318 ? 01 thru ? 07 and ? 09 obsolete, new standard 318 ? 08. mm inches scale 10:1 0.8 0.031...
Description	Small Signal MOSFET 8.0V, 3.7A, Single P Channel, SOT23(8.0V, 3.7A双功率MOSFET) 小信号MOSFET 8.0V.7A，单P通道，SOT23封装8.0V.7A双功率MOSFET的） Small Signal MOSFET -8 V, -3.7 A, Single P-Channel, SOT-23; Package: SOT-23 (TO-236) 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000 3700 mA, 8 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB
File Size	135.63K / 5 Page	View it Online	Download Datasheet

For thickness.0027 Found Datasheets File :: 1649 Search Time::1.484ms
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