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LITTELFUSE[Littelfuse]
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| Part No. |
3425L 3425L150 3425L200 3425L250 3425L300 3425L150DR 3425L200DR 3425L250DR 3425L300DR
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| OCR Text |
...: Materials: Terminal Material: tin Plated brass to MIL-T-10727B Solderability: Meets EIA specification RS186-9E and IPC/EIA J-STD-002, and IPC/EIA J-STD-001. Device Labeling: Device is marked with the letter `L', amperage rating and date c... |
| Description |
Resettable PTC. Ihold = 3.00A, Itrip = 6.0, Vmax = 6Vdc. Reel quantity 1500.
Resettable PTC. Ihold = 2.50A, Itrip = 5.0, Vmax = 15Vdc. Reel quantity 1500.
Resettable PTC. Ihold = 2.00A, Itrip = 4.0, Vmax = 15Vdc. Reel quantity 1500.
Resettable PTC. Ihold = 1.50A, Itrip = 3.0, Vmax = 15Vdc. Reel quantity 1500.
Surface Mount PTC
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| File Size |
158.71K /
2 Page |
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it Online |
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Motorola Mobility Holdings, Inc.
ONSEMI[ON Semiconductor]
MOTOROLA[Motorola Inc]
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| Part No. |
MSD1328-T1_D MSD1328-RT1 MSD1328RT1 ON2376
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| OCR Text |
...type of solder used was 62/36/2 tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ... |
| Description |
NPN Low Voltage Output Amplifier Surface Mount 500 mA, 20 V, NPN, Si, SMALL SIGNAL TRANSISTOR
CASE 318D3, STYLE 1 SC9
From old datasheet system
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| File Size |
112.82K /
4 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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| Part No. |
MV2105 MMBV2107LT1 MV2101 MV2109RLRA MV2109RLRP LV2205 MMBV2101LT1-D
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| OCR Text |
...type of solder used was 62/36/2 tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then h... |
| Description |
Silicon Tuning Diodes 6.8 - 100 pF, 30 Volts Voltage Variable Capacitance Diodes
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| File Size |
70.43K /
8 Page |
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it Online |
Download Datasheet |
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ON Semi
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| Part No. |
BSP62T1_D ON0222
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| OCR Text |
...type of solder used was 62/36/2 tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ... |
| Description |
MEDIUM POWER PNP SILICON
From old datasheet system
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| File Size |
123.28K /
6 Page |
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it Online |
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MOTOROLA[Motorola, Inc]
ON Semi
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| Part No. |
MSD601-ST1 MSD601-RT1 ON2380 MSD601RT1
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| OCR Text |
...type of solder used was 62/36/2 tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then ... |
| Description |
NPN General Purpose Amplifier Transistors Surface Mount
From old datasheet system
CASE 318D3, STYLE 1 SC9
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| File Size |
110.82K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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