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Integrated Circuit Syst... ICST[Integrated Circuit Systems]
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Part No. |
ICS680G-01T ICS680-01 ICS680G-01 ICS680G-01LF ICS680G-01LFT ICS68001
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OCR Text |
... to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted... |
Description |
From old datasheet system Networking Clock Synthesizer and Zero Delay Buffer
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File Size |
94.69K /
8 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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Part No. |
MAAPSS0111TR-3000 MAAPSS0111 MAAPSS0111SMB
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OCR Text |
...on. Metal foil thickness in the vias is critical to thermal resistance. The recommended metalization is 1 oz (35 mm minimum thickness). The application board is configured with 36 vias, each 12 mil (0.3048 mm) in diameter beneath the packag... |
Description |
1.25 W VSAT Power Amplifier 13.75-14.5 GHz
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File Size |
141.60K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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