| PART |
Description |
Maker |
| KTD2005 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| PC817B PC817C PC827 PC-817 PC817A PC847 PC837 PC81 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
Sharp Electrionic Compo...
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| HPCL-817 HPCL817 |
Phototransistor Optocoupler High Density Mounting Type
|
Agilent Technologies
|
| GDZT2R5.1 |
2-pin ultra mini-mold type for high-density mounting(GMD2)
|
Rohm
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| 5694F-A 5694F7 5694F1 5694F3 5694F5 |
High Density Right Angle Mounting T-1 LED Assembly
|
CML[Chicago Miniature Lamp,inc]
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| TIL199 TIL199A TIL199B TIL198A TIL198B |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| ISP521-1 ISP521-1X ISP521-108 ISP521-2 ISP521-2X I |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
