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 QS6J1
Transistors
Small switching (-20V, -1.5A)
QS6J1
Features 1) Two Pch MOSFET transistors in a single TSMT6 package. 2) Pch Treueh MOSFET have a low on-state resistance with a fast switching. 3) Nch Treueh MOSFET is reacted a low voltage drive (2.5V). External dimensions (Unit : mm)
TSMT6
1pin mark
(1)
2.8 1.6
(6)
0.4
(3)
0.16
(4)
Applications Switch
Each lead has same dimensions
Abbreviated symbol : J01
Structure Silicon P-channel MOSFET
Equivalent circuit
(6) 2 (5) 2 (4)
Packaging specifications
Package Type QS6J1
(1)
Taping TR 3000
1 (2) 1 (3)
(1) Tr1 Gate (2) Tr2 Source (3) Tr2 Gate (4) Tr2 Drain (5) Tr1 Source (6) Tr1 Drain
Code Basic ordering unit (pieces)
1 ESD PROTECTION DIODE 2 BODY DIODE
Absolute maximum ratings (Ta=25C)
Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body diode) Total power dissipation Channel temperature Range of Storage temperature Continuous Pulsed Continuous Pulsed Symbol VDSS VGSS ID IDP IS ISP PD Tch Tstg Limits -20 +12 - + -1.5 + -6 -0.75 -6 1.25 150 -55 to +150 Unit V V A A A A W / Total C C
1 1
2
1 Pw < 10s, Duty cycle < 1% 2 Mounted on a ceramic board - -
Thermal resistance
Parameter Channel to ambient Symbol Rth (ch-a) Limits 100 Unit C / W / Total
0.85
2.9
(2)
(5)
1/3
QS6J1
Transistors
Electrical characteristics (Ta=25C)
Parameter Symbol Min. IGSS - Gate-source leakage Drain-source breakdown voltage V(BR) DSS -20 Zero gate voltage drain current IDSS - VGS (th) -0.7 Gate threshold voltage - Static drain-source on-state RDS (on) - resistance - 1.0 Yfs Forward transfer admittance Ciss - Input capacitance Coss Output capacitance - Reverse transfer capacitance Crss - Turn-on delay time td (on) - Rise time tr - Turn-off delay time td (off) - Fall time tf - Total gate charge Qg - Gate-source charge Qgs - Gate-drain charge Qgd -
Pulsed
Typ. - - - - 155 170 310 - 270 40 35 10 12 45 20 3.0 0.8 0.85
Max. 10 - -1 -2.0 215 235 430 - - - - - - - - - - -
Unit A V A V m m m S pF pF pF ns ns ns ns nC nC nC
Conditions VGS=12V, VDS=0V ID= -1mA, VGS=0V VDS= -20V, VGS=0V VDS= -10V, ID= -1mA ID= -1.5A, VGS= -4.5V ID= -1.5A, VGS= -4V ID= -0.75A, VGS= -2.5V VDS= -10V, ID= -0.75A VDS= -10V VGS=0V f=1MHz ID= -0.75A VDD -15V VGS= -4.5V RL=20 RG=10 VDD -15V RL=10 VGS= -4.5V RG=10 ID= -1.5A


Body diode (Source-drain)
Parameter Forward voltage Symbol VSD Min. - Typ. - Max. -1.2 Unit V Conditions IS= -0.75A, VGS=0V
Electrical characteristic curves
1000
GATE-SOURCE VOLTAGE : -VGS (V)
Ta=25C f=1MHz VGS=0V
Ciss
1000
SWITCHING TIME : t (ns)
CAPACITANCE : C (pF)
tf
100
Ta=25C VDD= -15V VGS= -4.5A RG=10 Pulsed
8 7 6 5 4 3 2 1 0 0 0.5 1 1.5 2
Ta=25C VDD= -15V ID= -1.5A RG=10 Pulsed
100
td (off) td (on) tr
10
Coss Crss
10 0.01
0.1
1
10
100
1 0.01
0.1
1
10
2.5
3
3.5
DRAIN-SOURCE VOLTAGE : -VDS (V)
DRAIN CURRENT : -ID (A)
TOTAL GATE CHARGE : Qg (nC)
Fig.1 Typical Capacitance vs. Drain-Source Voltage
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (m)
10
Fig.2 Switching Characteristics
Fig.3 Dynamic Input Characteristics
DRAIN CURRENT : -ID (A)
400
ID= -1.5A ID= -0.75A
1
0.1
Ta=125C Ta=75C Ta=25C Ta= -25C
SOURCE CURRENT : -IS (A)
VDS= -10V Pulsed
500 Ta=25C Pulsed
10
Ta=25C VGS=0V Pulsed
300
1
200
0.1
0.01
100
0.001 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
0
0
2
4
6
8
10
12
GATE-SOURCE VOLTAGE : -VGS (V)
GATE-SOURCE VOLTAGE : -VGS (V)
0.01 0.0
0.5
1.0
1.5
2.0
SOURCE-DRAIN VOLTAGE : -VSD (V)
Fig.4 Typical Transfer Characteristics
Fig.5 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.6 Source Current vs. Source-Drain Voltage
2/3
QS6J1
Transistors
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (m)
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (m)
VGS= -4.5V Pulsed
Ta=125C Ta=75C Ta=25C Ta= -25C
VGS= -4V Pulsed
Ta=125C Ta=75C Ta=25C Ta= -25C
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (m)
10000
10000
10000
Ta=125C Ta=75C Ta=25C Ta= -25C
VGS= -2.5V Pulsed
1000
1000
1000
100
100
100
10 0.1
1
10
10 0.1
1
10
10 0.1
1
10
DRAIN CURRENT : -ID (A)
DRAIN CURRENT : -ID (A)
DRAIN CURRENT : -ID (A)
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current ()
Fig.8 Static Drain-Source On-State Resistance vs. Drain Current ()
Fig.9 Static Drain-Source On-State Resistance vs. Drain Current ()
Measurement circuits
Pulse Width
VGS ID RL D.U.T. RG VDD VDS
VGS
10% 50% 10%
90%
50% 10% 90%
VDS
90% td(on) ton tr td(off) toff
tr
Fig.10 Switching Time Measurement Circuit
Fig.11 Switching Waveforms
VG
VGS ID RL IG(Const) D.U.T. RG VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.12 Gate Charge Measurement Circuit
Fig.13 Gate Charge Waveform
3/3
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document use silicon as a basic material. Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0


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