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 SMTYxxA
Low forward voltage TVS: TranskyTM
Main applications
Power rail ESD transient over-voltages and reverse voltages protection for 5 and 12 V supplied IC's
A
Description
The Transky is designed specifically for miniaturized electronic devices and equipment subject to ESD transient over-voltages. The Transky combines the performance of a TransilTM or TVS (Transient Voltage Suppressor) and low forward voltage Schottky diode in a monolithic structure. It offers both an overshoot protection in the 6.4 V or 13.2 V clamping ranges and a negative spike protection in the -0.48 V clamping range compared to the -1 V with the standard Transil family on the 5 or 12 V power line. Its 600 W power capability offers high transient capability with SMA package.
K
SMA (JEDEC DO-214AC)
K
Features

Integration of a Transil with a Schottky diode JEDEC registred SMA package outline Low clamping factor VCL/VBR Fast response time RoHS compliant
A
Order code
Part number SMTY5.0A SMTY12A Marking Y5.0 Y12
Benefits

Optimized PCB area: up to 62% space saving versus discrete solution High peak pulse power: up to 600 W Stand-off voltage: 5 V for SMTY5.0A 12 V for SMTY12A Low forward voltage: 0.48 V @ 1 A Very low leakage current: 10 A @ 5 V for SMTY5.0A 20 A @12 V for SMTY12A
Complies with following standard
IEC 61000-4-2 Level 4 Air discharge 15 kV Contact discharge 8 kV

April 2006
Rev 1
1/7
www.st.com 7
Characteristics
SMTYxxA
1
Characteristics
Table 1.
Symbol Vpp P PPP IFSM Tstg Tj
dPtot --------------dTj
Absolute ratings (limiting value)
Parameter IEC 61000-4-2 level 4 standard Power dissipation on infinite heatsink Peak pulse Power dissipation (1) Non repetitive surge peak forward current Storage temperature range Maximum operating junction temperature (2) Air discharge Contact discharge Tamb = 25 C Tj initial = Tamb tp=10 ms Tj initial = Tamb Value 15 8 4 600 40 -65 to +175 150 Unit kV W W A C C
1. 10/1000s pulse waveform 2.
1 < -------------------------- thermal runaway condition for a Transky Rth ( j - a )
Table 2.
Symbol Rth(j-a) Rth(j-l)
Thermal resistance
Parameter Junction to ambient on printed circuit Junction to lead Value 120 30 Unit C/W C/W
Table 3.
Symbol IRM VRM VBR IR VCL IPP VF
Electrical characteristics
Parameter Leakage current @ VRM Stand-off voltage Breakdown voltage
VCL VBR VRM VF IRM IR V I IF
Reverse leakage current Clamping voltage Peak pulse current Forward voltage drop
IPP
IRM max @ VRM A SMTY5.0A SMTY12A 10 20 V 5 12
IRM max @ VCLmax @ IPP VBR min @ IR VRM @ 85 C 10/1000 s mA 0.5 1.2 V 5 12 V 6.4 13.2 mA 10 1 V 9 18.5 A 43.5 31
VF max @ 1A (1) V 0.48 0.48
T max 10-4/C 10 10
1. Pulse test tp = 500 s, < 2%
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SMTYxxA
Characteristics
Figure 1.
Pulse waveform (10/1000 s)
Figure 2.
Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
Tj initial = 25 C
Ppp(kW)
I
Pulse waveform 10/1000 s
1.E+01
1.E+00
tp(ms)
tp = 10 s
1000 s
1.E-01 0.01
0.10
1.00
10.00
Figure 3.
Relative variation of peak pulse power versus initial junction temperature
Figure 4.
Average power dissipation versus ambient temperature
110 100 90
%
P(W)
4.5 4.0 3.5
Rth(j-a)=Rth(j-l)
80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 Tj(C)
1.0 0.5 Tamb(C) 0.0 0 25 50 3.0 2.5 2.0 1.5
Rth(j-a)=120 C/W (PCB FR4, recommended pad layout)
75
100
125
150
Figure 5.
Variation of thermal impedance, Figure 6. junction to ambient, versus pulse duration (Epoxy, FR4, eCu = 35 m)
Thermal resistance, junction to ambient, versus copper surface under each lead (printed circuit board FR4, eCu = 35 m)
Zth(j-a) (C/W)
1000.0
SCU=3 mm Recommended pad layout
Rth(j-a) (C/W)
140 120 100 80
100.0
10.0
60 40 20
1.0
tp(s) 0.1 1.E-03
0
SCU(cm)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
3/7
Ordering information scheme
SMTYxxA
Figure 7.
Forward voltage drop versus forward current (typical values)
Figure 8.
Reverse leakage current versus junction temperature (typical values)
10.00
IF (A)
1.E+04
IR(A)
1.E+03
1.00
SMTY12A VR= 12 V
T j =85 C T j =25 C
1.E+02
1.E+01
0.10
SMTY5.0A VR= 5 V
1.E+00
V F (V) 0.01 0.0
T j(C) 1.E-01
1.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
25
50
75
100
125
150
Figure 9.
IPP(A)
SMTY5.0A Clamping voltage versus Figure 10. SMTY12A Clamping voltage versus peak pulse current (typical values) peak pulse current (typical values)
100.0
Tj initial =25 C 8/20 s
100.0
IPP(A)
Tj initial =25 C 8/20 s
10.0
10/1000 s
10.0
10/1000 s
1.0
SMTY5.0A
1.0
SMTY12A
VCL(V) 0.1 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
0.1 10 11 12 13 14 15 16 17 18
VCL(V) 19 20
2
Ordering information scheme
SMTY xx A
Transky Stand off voltage 5.0 = 5 V 12 = 12 V Package A = SMA package
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SMTYxxA
Package information
3
Table 4.
Package information
SMA (plastic) dimensions
Dimensions Ref. Millimeters Min. A1 A2 b c E E1 D L 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Inches Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063
Figure 11. Footprint dimensions (millimeter)
Figure 12. Marking information scheme
5.49
Cathode bar (unidirectional devices only )
e3
1.67
xxx z y ww
e3: ECOPACK ( Leadfree) XXX : Marking Z : Manufacturing location Y : Year WW : week
1.87
1.75
1.87
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5/7
Ordering information
SMTYxxA
4
Ordering information
Ordering type SMTY5.0A SMTY12A Marking Y5.0 Y12 Package SMA SMA Weight 0.068g 0.068g Base quantity Delivery mode 5000 5000 Tape and Reel Tape and Reel
5
Revision history
Date 24-Apr-2006 Revision 1 Initial release. Changes
6/7
SMTYxxA
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