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| IPB039N10N3 G OptiMOSTM3 Power-Transistor Features * N-channel, normal level * Excellent gate charge x R DS(on) product (FOM) * Very low on-resistance R DS(on) * High current capability * 175 C operating temperature * Pb-free lead plating; RoHS compliant * Qualified according to JEDEC1) for target application * Halogen-free according to IEC61249-2-21 Type IPB039N10N3 G Product Summary V DS R DS(on),max ID 100 3.9 160 V m A Package Marking PG-TO263-7 039N10N Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 C2) T C=100 C Pulsed drain current2) Avalanche energy, single pulse Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 1) 2) Value 160 113 640 340 20 Unit A I D,pulse E AS V GS P tot T j, T stg T C=25 C I D=100 A, R GS=25 mJ V W C T C=25 C 214 -55 ... 175 55/175/56 J-STD20 and JESD22 See figure 3 Rev.2.03 page 1 2009-12-17 IPB039N10N3 G Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient R thJC R thJA minimal footprint 6 cm2 cooling area3) 0.7 62 40 K/W Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=160 A V DS=100 V, V GS=0 V, T j=25 C V DS=100 V, V GS=0 V, T j=125 C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=100 A V GS=6 V, I D=50 A Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=100 A 100 2 2.7 0.1 3.5 1 A V 76 10 1 3.3 4.1 1.4 152 100 100 3.9 7.1 S nA m 3) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev.2.03 page 2 2009-12-17 IPB039N10N3 G Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 4) Gate to source charge Gate to drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge 4) C iss C oss C rss t d(on) tr t d(off) tf V DD=50 V, V GS=10 V, I D=100 A, R G=1.6 V GS=0 V, V DS=50 V, f =1 MHz - 6320 1210 41 27 59 48 14 8410 1610 - pF ns Q gs Q gd Q sw Qg V plateau Q oss V DD=50 V, V GS=0 V V DD=50 V, I D=100 A, V GS=0 to 10 V - 29 16 26 88 4.6 122 39 117 162 nC V nC IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=100 A, T j=25 C V R=50 V, I F=100A , di F/dt =100 A/s - 1 68 135 160 640 1.2 - A V ns nC See figure 16 for gate charge parameter definition Rev.2.03 page 3 2009-12-17 IPB039N10N3 G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS10 V 250 180 160 200 140 120 150 P tot [W] I D [A] 100 50 0 0 50 100 150 200 100 80 60 40 20 0 0 50 100 T C [C] 150 200 T C [C] 3 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 103 limited by on-state resistance 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 100 1 s 10 s 100 s 0.5 102 1 ms 0.2 101 Z thJC [K/W] I D [A] 10 ms 10-1 0.1 DC 0.05 0.02 100 0.01 single pulse 10-1 10 -1 10-2 10 0 10 1 10 2 10 3 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev.2.03 page 4 2009-12-17 IPB039N10N3 G 5 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 250 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 C parameter: V GS 8 4.5 V 5V 10 V 6V 7 200 6 7.5 V 5.5 V 150 R DS(on) [m] 5 6V I D [A] 5V 4 7.5 V 10 V 100 3 4.5 V 2 50 1 0 0 1 2 0 0 40 80 120 160 200 240 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 250 8 Typ. forward transconductance g fs=f(I D); T j=25 C 240 200 200 160 150 g fs [S] 100 50 25 C 175 C I D [A] 120 80 40 0 0 2 4 6 0 0 40 80 120 160 200 V GS [V] I D [A] Rev.2.03 page 5 2009-12-17 IPB039N10N3 G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=100 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 9 8 7 4 3.5 3 6 1600 A R DS(on) [m] 2.5 5 4 3 2 1 0 -60 -20 20 60 100 140 180 1 98 % typ V GS(th) [V] 160 A 2 1.5 0.5 0 -60 -20 20 60 100 140 180 T j [C] T j [C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 Ciss 103 175 C, 98% Coss 25 C 103 102 C [pF] I F [A] 175 C 102 Crss 101 25 C, 98% 101 0 20 40 60 80 100 0 0.5 1 1.5 2 V DS [V] V SD [V] Rev.2.03 page 6 2009-12-17 IPB039N10N3 G 13 Avalanche characteristics I AS=f(t AV); R GS=25 parameter: T j(start) 1000 14 Typ. gate charge V GS=f(Q gate); I D=100 A pulsed parameter: V DD 10 8 80 V 100 25 C 100 C 50 V 6 V GS [V] I AS [A] 20 V 150 C 4 10 2 1 1 10 100 1000 0 0 20 40 60 80 100 t AV [s] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 110 V GS Qg 105 V BR(DSS) [V] 100 V g s(th) 95 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 90 T j [C] Rev.2.03 page 7 2009-12-17 IPB039N10N3 G PG-TO263-3: Outline Rev.2.03 page 8 2009-12-17 IPB039N10N3 G Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev.2.03 page 9 2009-12-17 |
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