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| NLX2G08 Dual 2-Input AND Gate The NLX2G08 is a high performance dual 2-input AND Gate operating from a 1.65 V to 5.5 V supply. Features * * * * * * * * * * Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ08 Chip Complexity: FET = 124 This is a Pb-Free Device A1 7 B1 6 Y2 5 http://onsemi.com MARKING DIAGRAM 1 AD MG G 1 8 UQFN8 MU SUFFIX CASE 523AN AD = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. VCC 8 4 GND A1 B1 1 Y1 2 B2 3 A2 A2 B2 IEEE/IEC & Y1 Y2 Figure 1. Pinout PIN ASSIGNMENT Pin 1 2 3 4 5 6 7 8 Function Y1 B2 A2 GND Y2 B1 A1 VCC A L L H H Figure 2. Logic Symbol FUNCTION TABLE Y = AB Inputs B L H L H Output Y L L L H H = HIGH Logic Level L = LOW Logic Level (c) Semiconductor Components Industries, LLC, 2009 April, 2009 - Rev. 0 1 Publication Order Number: NLX2G08/D NLX2G08 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 85C (Note 5) (Note 1) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to VCC + 0.5 *50 *50 $50 $100 $100 *65 to )150 260 )150 TBD 250 Level 1 UL 94 V-0 @ 0.125 in > 2000 > 200 N/A $500 V Unit V V V mA mA mA mA mA C C C C/W mW ILatch-Up Latch-Up Performance mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate Operating Data Retention Only (Note 6) (HIGH or LOW State) 1.65 1.5 0 0 -55 5.5 5.5 5.5 VCC +125 20 10 5 V V V C ns/V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 0 0 0 6. Unused inputs may not be left open. All inputs must be tied to a high- or low-logic input voltage level. http://onsemi.com 2 NLX2G08 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH Parameter High-Level Input Voltage Low-Level Input Voltage High-Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = -3 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA VIN = VCC or GND VIN = VCC or GND Condition VCC (V) 1.65 2.3 to 5.5 1.65 2.3 to 5.5 1.65 to 5.5 165 2.3 2.7 3.0 3.0 4.5 1.65 to 5.5 2.3 2.7 3.0 3.0 4.5 0 to 5.5 5.5 VCC - 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.5 2.1 2.4 2.7 2.5 4.0 0.08 0.20 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $0.1 1.0 TA = 255C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC - 0.1 1.5 1.9 2.2 2.4 2.3 3.8 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $1.0 10 Typ Max -555C v TA v 1255C Min 0.75 VCC 0.7 VCC 0.25 0.3 VCC Max Unit V V V VOL Low-Level Output Voltage VIN = VIH or VOH V IIN ICC Input Leakage Current Quiescent Supply Current mA mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF (V) 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 Min 2.0 1.0 0.8 1.2 0.5 0.8 TA = 255C Typ 5.7 3.5 2.6 3.2 1.9 2.5 Max 10.5 5.8 3.9 4.8 3.1 3.7 -555C v TA v 1255C Min 2.0 2.0 0.8 1.2 0.5 0.8 Max 11.0 6.2 4.3 5.2 3.3 4.0 Unit ns CAPACITIVE CHARACTERISTICS Symbol CIN CPD Input Capacitance Power Dissipation Capacitance (Note 7) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical 4 25 30 Unit pF pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NLX2G08 VCC INPUT 50% An and Bn tPLH 50% VCC 50% VCC GND tPHL VOH RL CL OUTPUT Yn VOL A 1-MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NLX2G08MUTCG Package Type UQFN8 (Pb-Free) Tape and Reel Size 3000 Unit / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLX2G08 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN-01 ISSUE O D A B EXPOSED Cu MOLD CMPD NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DIM A A1 A3 b D E e L L1 L3 MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 --- 0.15 0.25 0.35 2X 0.10 C 2X 0.10 C 0.05 C b 0.05 C SIDE VIEW A1 8X 8X L 3 5 DETAIL A ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EEE EEE TOP VIEW DETAIL B 1 8 7 PIN ONE REFERENCE E A1 OPTIONAL CONSTRUCTION (A3) A (0.10) C SEATING PLANE L3 e 0.35 8X b 0.10 C A B 7X BOTTOM VIEW 0.05 C NOTE 3 http://onsemi.com 5 EEE EEE CCC CCC DETAIL B L1 A3 L3 (0.15) OPTIONAL CONSTRUCTION DETAIL A SOLDERING FOOTPRINT* 1.70 1 0.50 PITCH 1.70 0.25 0.53 DIMENSIONS: MILLIMETERS 8X *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NLX2G08/D |
Price & Availability of NLX2G08
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