doc. no : qw0905- rev. : date : data sheet L8Y17130-PF ligitek electronics co.,ltd. property of ligitek only - 2007 01 - aug. L8Y17130-PF a lead-free parts pb two step rectangle type led lamps
note : 1.all dimension are in millimeter tolerance is ligitek electronics co.,ltd. property of ligitek only L8Y17130-PF part no. 1/5 page 10.0 25.0min
2/5 10 gaasp/gap yellow L8Y17130-PF 110 12 4.5 2.1 1.7 35 585 yellow diffused i fp pd i f tstg t opr symbol power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 50 -40 ~ +100 -40 ~ +85 ir10 ratings yellow 50 15 mw " " # a ma ma unit color material part no emitted typ. luminous intensity @10ma(mcd) spectral halfwidth $% nm peak wave length % pnm lens typ. forward voltage @ ma(v) min.min. viewing angle 2 & 1/2 (deg) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 " typical electrical & optical characteristics (ta=25 " ) ligitek electronics co.,ltd. property of ligitek only page part no.L8Y17130-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ligitek electronics co.,ltd. property of ligitek only 500550600650 0.0 0.5 1.0 700 8y chip page3/5 part no.L8Y17130-PF
2.wave soldering profile 5 0 ' preheat 0 50 25 ' 120 ' 2 100 time(sec) 150 dip soldering preheat: 120 260 ' temp(
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. solder resistance test solderability test 1.t.sol=230 " 5 " 2.dwell time=5 1sec 1.t.sol=260 " 5 " 2.dwell time= 10 1sec. low temperature storage test high temperature high humidity test thermal shock test 1.ta=65
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