surface mount general rectifier reverse voltage - 50 to 1000 volts forward current - 1.0 ampere maximum ratings and electrical characteristics m1f volts volts volts symbols units amp amps volts v rrm v rms v dc i (av) i fsm v f 1.0 30.0 1.1 operating junction and storage temperature range maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current at t l =75 c peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) maximum instantaneous forward voltage at 1.0a maximum dc reverse current t a =25 c at rated dc blocking voltage t a =100 c typical junction capacitance (note 1) note: 1.measured at 1mhz and applied reverse voltage of 4.0v d.c. 2.p.c.b. mounted with 0.2x0.2 ? (5.0x5.0mm) copper pad areas i r 5.0 50.0 r q ja c j t j , t stg 75.0 15.0 -50 to +150 pf c a m typical thermal resistance (note 2) c/w ratings at 25 c ambient temperature unless otherwise specified. single phase half-wave 60hz,resistive or inductive load,for capacitive load current derate by 20%. m2f m3f m4f M5F m6f m7f features mechanical data 50 35 50 100 70 100 200 140 200 400 280 400 600 420 600 800 560 800 1000 700 1000 dimensions in inches and (millimeters) mdd electronic m1 thru m7 mdd catalog number smaf cathode band top view 0.128(3.25) 0.144(3.65) 0.189(4.80) 0.173(4.40) 0.110(2.80) 0.094(2.40) 0.051(1.30) 0.059(1.50) 0.055(1.40) 0.043(1.10) 0.012(0.30) 0.006(0.15) 0.047(1.20) 0.028(0.70) the plastic package carries underwriters laboratory flammability classification 94v-0 for surface mounted applications low reverse leakage built-in strain relief,ideal for automated placement high forward surge current capability high temperature soldering guaranteed: 260 c/10 seconds at terminals glass passivated chip junction case terminals : solder plated, solderable per mil-std-750, method 2026 polarity : color band denotes cathode end mounting position : any weight :0.0018 ounce, 0.064 grams : jedec smaf molded plastic body over passivated chip
1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 175 30 25 20 15 10 5.0 0.6 0.8 1.0 1.2 1.4 1.5 0.1 1.0 10 100 0.01 0.1 1 10 100 100 10 1 0.1 reverse voltage,volts t,pulse duration,sec. fig. 5-typical junction capacitance fig. 6-typical transient thermal impedance fig. 3-typical instantaneous forward characteristics number of cycles at 60 hz fig. 2-maximum non-repetitive peak forward surge current fig. 1- forward current derating curve average forward rectified current, amperes instantaneous forward current,amperes junction capacitance, pf peak forward surge current, amperes instantaneous forward voltage, volts single phase half wave 60hz resistive or inductive load 1 10 100 8.3ms single half sine-wave (jedec method) 0.01 0.1 1 20 10 t j =25 c 1 10 100 200 0 20 40 60 80 100 1,000 100 10 1 0.1 0.01 tj=100 c tj=25 c tj=150 c percent of peak reverse voltage,% fig. 4-typical reverse characteristics instantaneous reverse current, microamperes transient thermal impedance, c/w ambient temperature, c t j =25 c pulse width=300 m s 1%duty cycle mdd electronic ratings and characteristic curves m1f thru m7f
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