1. 2. 3. material content data sheet sales product name ikw30n60t issued 29. august 2013 ma# MA001067380 package pg-to247-3-41 weight* 6048.65 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.686 0.06 0.06 609 609 leadframe non noble metal iron 7439-89-6 0.530 0.01 88 inorganic material phosphorus 7723-14-0 0.159 0.00 26 non noble metal copper 7440-50-8 529.068 8.75 8.76 87469 87583 wire non noble metal aluminium 7429-90-5 17.214 0.28 0.28 2846 2846 encapsulation organic material carbon black 1333-86-4 19.914 0.33 3292 plastics epoxy resin - 378.365 6.26 62554 inorganic material silicondioxide 60676-86-0 1593.117 26.34 32.93 263384 329230 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5270 5270 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4805 4805 solder non noble metal antimony 7440-36-0 0.318 0.01 53 noble metal silver 7440-22-4 0.794 0.01 131 non noble metal tin 7440-31-5 2.065 0.03 0.05 341 525 heatspreader non noble metal iron 7439-89-6 3.442 0.06 569 inorganic material phosphorus 7723-14-0 1.033 0.02 171 non noble metal copper 7440-50-8 3438.006 56.83 56.91 568392 569132 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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