1. 2. 3. material content data sheet sales product name tle7272-2d issued 28. august 2013 ma# MA000669530 package pg-to252-5-11 weight* 356.51 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.671 0.47 0.47 4688 4688 leadframe non noble metal iron 7439-89-6 0.205 0.06 574 inorganic material phosphorus 7723-14-0 0.061 0.02 172 non noble metal copper 7440-50-8 204.243 57.29 57.37 572903 573649 wire non noble metal aluminium 7429-90-5 0.153 0.04 0.04 430 430 encapsulation organic material carbon black 1333-86-4 1.417 0.40 3974 plastics epoxy resin - 24.796 6.96 69553 inorganic material silicondioxide 60676-86-0 115.480 32.39 39.75 323920 397447 leadfinish non noble metal tin 7440-31-5 5.072 1.42 1.42 14228 14228 plating non noble metal nickel 7440-02-0 0.076 0.02 214 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 215 solder noble metal silver 7440-22-4 0.083 0.02 234 non noble metal tin 7440-31-5 0.067 0.02 187 non noble metal lead 7439-92-1 3.181 0.89 0.93 8922 9343 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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