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  70567-0016 Datasheet PDF File

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    A-70567-0281 0015800229

Molex Electronics Ltd.
Part No. A-70567-0281 0015800229
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

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Renesas Electronics Corporation

Part No. R7S910016CBG#AC0
Description Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0282 0015800249

Molex Electronics Ltd.
Part No. A-70567-0282 0015800249
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Renesas Electronics Corporation

Part No. 8001601CA
Description 3.2 Microsecond Sample and Hold Amplifiers
Tech specs    

Official Product Page

    0015800205 15-80-0205 70567-0144

Molex Electronics Ltd.
Part No. 0015800205 15-80-0205 70567-0144
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Renesas Electronics Corporation

Part No. HSP50016JC-52
Description Digital Down Converter
Tech specs    

Official Product Page

    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021444-00016T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 16 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    A-70567-0358 15-80-1401 0015801401

Molex Electronics Ltd.
Part No. A-70567-0358 15-80-1401 0015801401
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00016C4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    15-80-0089 0015800089 A-70567-0274

Molex Electronics Ltd.
Part No. 15-80-0089 0015800089 A-70567-0274
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.52K  /  7 Page

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Amphenol Communications Solutions

Part No. 10121506-320016ALF
Description HPCE STD VT Receptacle 32P16S
Tech specs    

Official Product Page

    0015800685 70567-0168 A-70567-0168 15-80-0685

Molex Electronics Ltd.
Part No. 0015800685 70567-0168 A-70567-0168 15-80-0685
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P
MOLEX Connector

File Size 1,218.47K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021323-00016T8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0101 15-80-0703 0015800703

Molex Electronics Ltd.
Part No. A-70567-0101 15-80-0703 0015800703
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

File Size 1,218.28K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021323-00016D8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0102 0015800723

Molex Electronics Ltd.
Part No. A-70567-0102 0015800723
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021512-00016T8LF
Description 1.27mm (0.05in.) pitch, Shrouded header, 16 contacts
Tech specs    

Official Product Page

    0015800683 A-70567-0100 15-80-0683

Molex Electronics Ltd.
Part No. 0015800683 A-70567-0100 15-80-0683
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 55510-016LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

For 70567-0016 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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