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  70567-0016 Datasheet PDF File

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    70567-0016 A-70567-0016 15-81-0361

Molex Electronics Ltd.
Part No. 70567-0016 A-70567-0016 15-81-0361
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

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Renesas Electronics Corporation

Part No. R7S910016CBG#AC0
Description Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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Renesas Electronics Corporation

Part No. 8001601CA
Description 3.2 Microsecond Sample and Hold Amplifiers
Tech specs    

Official Product Page

    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. HSP50016JC-52
Description Digital Down Converter
Tech specs    

Official Product Page

    A-70567-0006 0015800161 15-80-0161 705670006

Molex Electronics Ltd.
Part No. A-70567-0006 0015800161 15-80-0161 705670006
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021444-00016T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 16 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    ACTR0016 ACTR0016_916.5_QCC8C ACTR0016/916.5/QCC8C

Advanced Crystal Technology
Part No. ACTR0016 ACTR0016_916.5_QCC8C ACTR0016/916.5/QCC8C
Description true one-port, surface-acoustic-wave (SAW) resonator

File Size 59.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021121-00016C4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    ACTF0016 ACTF0016_916.5_QCC8C ACTF0016/916.5/QCC8C

Advanced Crystal Technology
Part No. ACTF0016 ACTF0016_916.5_QCC8C ACTF0016/916.5/QCC8C
Description low-loss, compact, and economical surface-acoustic-wave (SAW)

File Size 77.62K  /  3 Page

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Amphenol Communications Solutions

Part No. 10121506-320016ALF
Description HPCE STD VT Receptacle 32P16S
Tech specs    

Official Product Page

    Elektron Components Ltd.
Part No. PF0007/28 PF0006 PF0016/10/28 PF0006/28
Description EN60 320-1 Standard Sheet C18 Class II Cold Condition (Fused)

File Size 119.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021323-00016T8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021323-00016D8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021512-00016T8LF
Description 1.27mm (0.05in.) pitch, Shrouded header, 16 contacts
Tech specs    

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 55510-016LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

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