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  70567-0016 Datasheet PDF File

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    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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Renesas Electronics Corporation

Part No. R7S910016CBG#AC0
Description Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,211.71K  /  7 Page

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Renesas Electronics Corporation

Part No. 8001601CA
Description 3.2 Microsecond Sample and Hold Amplifiers
Tech specs    

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

File Size 1,211.75K  /  7 Page

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Renesas Electronics Corporation

Part No. HSP50016JC-52
Description Digital Down Converter
Tech specs    

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021444-00016T4LF
Description Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 16 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021121-00016C4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10121506-320016ALF
Description HPCE STD VT Receptacle 32P16S
Tech specs    

Official Product Page

    70567-0013 A-70567-0013 15-80-0301

Molex Electronics Ltd.
Part No. 70567-0013 A-70567-0013 15-80-0301
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021323-00016T8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021323-00016D8LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    A-70567-0364 15-80-1521

Molex Electronics Ltd.
Part No. A-70567-0364 15-80-1521
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 20021512-00016T8LF
Description 1.27mm (0.05in.) pitch, Shrouded header, 16 contacts
Tech specs    

Official Product Page

    450-0016

CAMBION Electronic Components
Part No. 450-0016
Description socket for patch lead ends, for .059 - .062 (1,52 - 1,57) diameter pins

File Size 24.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 55510-016LF
Description <span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

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