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Molex Electronics Ltd.
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| Part No. |
0015800381 70567-0017 15-80-0381
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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| File Size |
1,218.40K /
7 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
R7S910016CBG#AC0
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| Description |
Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
8001601CA
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| Description |
3.2 Microsecond Sample and Hold Amplifiers
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0107 0015800107 A-70567-0207
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.53K /
7 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
HSP50016JC-52
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| Description |
Digital Down Converter
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0105 0015800105 A-70567-0139
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021444-00016T4LF
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| Description |
Minitek127®, Wire to Board connector, IDC Receptacle, Double Row, 16 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021121-00016C4LF
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| Description |
Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 16Positions, 1.27mm (0.5inch) pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800281 70567-0012 15-80-0281
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10121506-320016ALF
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| Description |
HPCE STD VT Receptacle 32P16S
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021323-00016T8LF
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| Description |
Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800149 15-80-0149 A-70567-0277
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021323-00016D8LF
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| Description |
Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 16 positions, 1.27mm (0.500in) pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800147 15-80-0147 A-70567-0209
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
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| File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021512-00016T8LF
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| Description |
1.27mm (0.05in.) pitch, Shrouded header, 16 contacts
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55510-016LF
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| Description |
<span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 10131937</b></span><br><br>Minitek® 2.00mm, Board to Board Connector, PCB Mounted Receptacle , Vertical , Surface Mount, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
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Official Product Page
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