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Amphenol Communications Solutions |
| Part No. |
131-4114-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3114-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8114-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78511-411HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
134-3114-11D
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| Description |
Paladin,backplane connectors,3-Pair, 4 Column, Open Wall, Right Angle Male, 1.5mm Wipe, NiS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-5114-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879111411 87911-1411
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-4114-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54111-411041850LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Semtech, Corp.
Semtech Corporation
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| Part No. |
SET111411 SET111403 SET111412 SET111419 SET111404
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| Description |
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?400V,娓╁害55???骞冲??存??垫?45A,楂??搴?澶х?娴?涓???ㄦ尝妗ユ?娴??)
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?1000V,娓╁害55???骞冲??存??垫?30A,楂??搴?澶х?娴?涓???ㄦ尝妗ユ?娴??)
3 PHASE, 30 A, SILICON, BRIDGE RECTIFIER DIODE
High Density,High Current,3-Phase Full Wave Bridge Rectifier(????靛?150V,娓╁害55???骞冲??存??垫?45A,楂??搴?澶х?娴??涓???ㄦ尝妗ユ?娴??)
High Density,High Current,3-Phase Full Wave Bridge Rectifier(反向电压1000V,温度55℃时平均整流电流45A,高密大电三相全波桥整流器) 高密度，大电3 -相全波桥式整流器（反向电000V的温5℃时平均整流电流45A条，高密度，大电流，三相全波桥整流器
HIGH CURRENT, 3-PHASE FULL WAVE BRIDGE ASSEMBLY
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| File Size |
113.74K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-7114-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6114-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 1141LF |
| Maker: AT&T |
| Pack: SOP16 |
| Stock: 370 |
| Unit price
for : |
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50: $0.97 |
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100: $0.92 |
| 1000:
$0.87 |
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Email: oulindz@gmail.com |
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Contact us |
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