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![71764-0028 0717640028](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0028 0717640028
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, Tin (Sn) Plating
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File Size |
120.83K /
5 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
R7S910028CBG#AC0
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Description |
Microprocessors for Real-Time Control and Networking of Industrial Equipment by only one chip
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
8N3QV01EG-0028CDI
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Description |
Quad-Frequency Programmable VCXO
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Tech specs |
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Official Product Page
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![71764-0008](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0008
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
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File Size |
121.06K /
5 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
8N3QV01EG-0028CDI8
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Description |
Quad-Frequency Programmable VCXO
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Tech specs |
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Official Product Page
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![71764-0114](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0114
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.23K /
5 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
HA4-5002/883
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Description |
Monolithic, Wideband, High Slew Rate, High Output Current Buffer
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Tech specs |
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Official Product Page
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![71764-0020](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0020
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
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File Size |
121.14K /
5 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
HA2-5002/883
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Description |
Monolithic, Wideband, High Slew Rate, High Output Current Buffer
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Tech specs |
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Official Product Page
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![71764-0108](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0108
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.01K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10028916-4455P00LF
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Description |
AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
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Tech specs |
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Official Product Page
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![71764-0116](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0116
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.10K /
5 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
20021121-00028D4LF
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Description |
Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 28Positions, 1.27mm (0.5inch) pitch.
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Tech specs |
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Official Product Page
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![71764-0118](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0118
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
120.86K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
20021323-00028T8LF
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Description |
Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 28 positions, 1.27mm (0.500in) pitch.
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Tech specs |
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Official Product Page
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![71764-0120](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0120
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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File Size |
121.16K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10028916-4444P00LF
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Description |
AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
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Tech specs |
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Official Product Page
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![71764-0018](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
71764-0018
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Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
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File Size |
120.83K /
5 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Amphenol Communications Solutions |
Part No. |
10028916-4554P00LF
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Description |
AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
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Tech specs |
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Official Product Page
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Price and Availability
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