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Texas Instruments |
| Part No. |
TPS781 TPS781330220DDCRG4 TPS781250200DDCR TPS781250200DDCT TPS78101DDCR TPS78101DDCT TPS78101DRVR TPS78101DRVT TPS781330220DDCR TPS781330220DDCT TPS781330220DRVR TPS781330220DRVT
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| Description |
150mA, LDO Reg, Ultralow-Power, Iq 1uA w/ Pin-Selectable, Dual-Level Output Volt datasheet (Rev. B)
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| Release Date |
05/11/2008 |
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Download PDF File |
Official Product Page
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Renesas Electronics Corporation |
| Part No. |
738125-000
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| Description |
COMP LOGIC
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
467-8125-062
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| Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-807081250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8125-062
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877581250 87758-1250
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
135.77K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
499-8125-062
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| Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row HSD, 25 positions, left, adv mate, 6.25mm (0.246in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54111-406081250LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
495-8125-063
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, 4.25mm (0.167in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
499-8125-063
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| Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row HSD, 25 positions, left, adv mate, 4.25mm (0.167in), Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-107281250LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0781250008
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| Description |
1.00mm (.039) Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Surface Mount, 1.8 V, Center Keys
1.00mm (.039") Pitch DDR2 DIMM Socket, Very Low Profile, Vertical, Surface Mount, 1.8 V, Center Keys
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| File Size |
581.08K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
498-8125-064
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| Description |
VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 25 positions, left, adv mate, 5.15mm (0.202in), Header.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 812AZF |
| Maker: N/A |
| Pack: N/A |
| Stock: 195 |
| Unit price
for : |
|
50: $70.15 |
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100: $66.65 |
| 1000:
$63.14 |
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